Características del producto:

Código: 27056
AM4 / AMD X570 / ATX / HDMI / USB TIPOC / RJ45 / SLI, CROSSFIREX / WIFI AX / RGB LED

Características detalladas del producto:

.

.
• Supports AMD 3rd Gen Ryzen™/ 2nd Gen Ryzen™/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ Ryzen™ with Radeon™ Vega Graphics Processors
.
• Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
.
• 12+2 Phases IR Digital VRM Solution with Power Stage
.
• Advanced Thermal Design with Fins-Array Heatsink and Direct Touch Heatpipe
.
• Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Triple Thermal Guards
.
• Intel® WiFi 6 802.11ax 2T2R & BT 5
.
• ALC1220-VB Enhance 114dB(Rear)/ 110dB(Front) SNR in Microphone with WIMA Audio Capacitors
.
• Intel® Gigabit LAN with cFosSpeed Internet Accelerator Networking
.
• RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show design, support Addressable LED & RGB LED strips
.
• Smart Fan 5 features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
.
• Front & Rear USB 3.1 Gen2 Type-C™ Header & HDMI 2.0 support
.
• Integrated I/O Shield Armor
.
• Q-Flash Plus Update BIOS Without Installing CPU, Memory and Graphics Card
.

. . . Especificaciones:. . Procesador. AMD Socket AM4, support for: 3rd Generation AMD Ryzen™ processors/ 2nd Generation AMD Ryzen™ processors/ AMD Ryzen™ with Radeon™ Vega Graphics processors. . Chipset. AMD X570. . Memoria.

.
1. 3rd Generation AMD Ryzen™ processors:. Support for DDR4 4400(O.C.) / 4300(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 2933 / 2667 / 2400 / 2133 MHz memory modules
.
2. 2nd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors:. Support for DDR4 3600(O.C.) / 3400(O.C.) / 3333(O.C.) / 3200(O.C.) / 2933 / 2667 / 2400 / 2133 MHz memory modules
.
3. 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
.
4. Arquitectura de memoria Dual Channel
.
5. Soporte para módulos de memoria ECC Un-buffered DIMM 1Rx8/2Rx8
.
6. Soporte para módulos de memoria non-ECC Un-buffered DIMM 1Rx8/2Rx8
.
7. Soporte para módulos de memoria Extreme Memory Profile (XMP)
.

. . Gráfica Integrada. Procesador gráfico integrado:. .

.
1. 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz
.
2. * Support for HDMI 2.0 version, HDCP 2.2, and HDR. .
.

. Maximum shared memory of 16 GB. Nota: For 2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors only.. . Audio.

.
1. Realtek® ALC1220-VB codec
.
2. * The back panel line out jack supports DSD audio.
.
3. Audio de alta definición
.
4. 2/4/5.1/7.1-channel
.
5. Soporte para salida S / PDIF
.

. . LAN. Chip Intel® GbE LAN (10/100/1000 Mbit). . Módulo de comunicaciones inalámbricas.

.
1. Wi-Fi 802.11a/b/g/n/ac/ax, supporting 2.4/5 GHz Dual-Band
.
2. BLUETOOTH 5.0
.
3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
.
4. * La tasa de datos real puede variar según el equipo y el entorno.
.

. Zócalos de Expansión. . Integrated in the CPU (PCIEX16/PCIEX8):. .

.
• 3rd Generation AMD Ryzen™ processors:.
  .
  • 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16 (PCIEX16)
  .
  • 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x8 (PCIEX8)
  .
  .
.
• 2nd Generation AMD Ryzen™ processors:.
  .
  • 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x16 (PCIEX16)
  .
  • 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x8 (PCIEX8)
  .
  • * Para un rendimiento óptimo, aunque sea con una única tarjeta gráfica PCI Express instalada, asegúrese de conectarla en la ranura PCIEx16.
  .
  • * The PCIEX8 slot shares bandwidth with the PCIEX16 slot. When using the 3rd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen™ processors, the PCIEX16 slot operates at up to x8 mode.
  .
  .
.
• 2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors:.
  .
  • 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x8 (PCIEX16)
  .
  .
.

. . Integrated in the Chipset (PCIEX4/PCIEX1):.

.
• 1 x PCI Express x16 slot, supporting PCIe 4.0*/3.0 and running at x4 (PCIEX4). * For 3rd Generation AMD Ryzen™ processors only.
.
• 2 x PCI Express x1 slots, supporting PCIe 4.0*/3.0. * For 3rd Generation AMD Ryzen™ processors only.
.

. Interfaz de almacenamiento. . Integrated in the CPU (M2A_SOCKET):.

.
• 3rd Generation AMD Ryzen™ processors:. 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 4.0 x4/x2 SSD support)
.
• 2nd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen™ with Radeon™ Vega Graphics processors/AMD Ryzen™ with Radeon™ Vega Graphics processors:. 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 3.0 x4/x2 SSD support).
.

. Integrated in the Chipset (M2B_SOCKET/M2C_SOCKET):.

.
• 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 4.0*/3.0 x4/x2 SSD support) (M2B_SOCKET). * For 3rd Generation AMD Ryzen™ processors only.
.
• 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280 SATA and PCIe 4.0*/3.0 x4/x2 SSD support) (M2C_SOCKET). * For 3rd Generation AMD Ryzen™ processors only.
.
• 6 x conector SATA 6Gb/s
.
• Soporta RAID 0, RAID 1, y RAID 10. * Consulte los conectores internos ''1-9'' para saber los avisos de instalación de los conectores M.2 y SATA.
.

. . Tecnología Multi Gráfica.

.
• Compatibilidad con las tecnologías NVIDIA® Quad-GPU SLI™ y 2-Way NVIDIA® SLI™
.
• Support for AMD Quad-GPU CrossFire™ and 2-Way AMD CrossFire™ technologies. * For 3rd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen™ processors only..
.

. USB. Chipset+USB 2.0 Hub:.

.
• 8 x puertos USB 2.0/1.1 (4 puertos en el panel posterior, 4 puertos disponibles a través de los conectores USB internos)
.

. . Chipset:.

.
• Integrated in the CPU:
.

.

.
• 3 x USB 3.2 Gen 1 ports on the back panel
.
• 1 x USB 3.2 Gen 2*/Gen 1 Type-A port (red) on the back panel. * For 3rd Generation AMD Ryzen™ processors only.
.

. . Conectores Internos E/S.

.
• 1 x conector de alimentación principal ATX 24-pin
.
• 1 x conector de alimentación ATX 12V 8-pin
.
• 1 x 4-pin ATX 12V power connector
.
• 1 x conector del ventilador de la CPU
.
• 1 x conexión del ventilador para refrigeración por agua
.
• 3 x conector del ventilador del sistema
.
• 2 x conectores para los ventiladores del sistema/para las bombas de refrigeración líquida
.
• 2 x Addressable LED strip headers
.
• 2 x RGB LED strip headers
.
• 1 x CPU cooler LED strip/RGB LED strip header
.
• 3 x M.2 Socket 3 connectors
.
• 6 x conector SATA 6Gb/s
.
• 1 x conector del panel frontal
.
• 1 x conector de audio en el panel frontal
.
• 1 x USB Type-C™ port, with USB 3.2 Gen 2 support
.
• 2 x USB 3.2 Gen 1 headers
.
• 2 x conectores USB 2.0/1.1
.
• 1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only)
.
• La función TPM es opcional según las diferentes políticas locales
.
• 1 x Clear CMOS jumper
.
• 2 x cabezales de sensor de temperatura
.
• 1 x Q-Flash Plus button
.

. . Panel E/S Trasero.

.
• 2 x conectores de antena SMA (2T2R)
.
• 1 x HDMI
.
• 1 x USB Type-C™ port, with USB 3.2 Gen 2 support
.
• 1 x USB 3.2 Gen 2*/Gen 1 Type-A port (red). * For 3rd Generation AMD Ryzen™ processors only.
.
• 1 x USB 3.2 Gen 2 Type-A port (red)
.
• 3 x USB 3.2 Gen 1 ports
.
• 4 x puertos USB 2.0/1.1
.
• 1 x Puerto RJ-45
.
• 1 x conector óptico S/PDIF Out
.
• 5 x audio jacks
.

. . Formato. Factor de forma ATX, 30.5cm x 24.4cm

Características técnicas del producto:

• CHIPSET: AMD X570
• FORMATO: ATX
• HDMI: SI
• IMAGEN SALIDA: GRAFICOS EN CPU, HDMI
• MEMORIA MAXIMA: 128 GB
• MICROPROCESADOR INTEGRADO: NO
• MULTI-GRAFICA: AMD Quad GPU CrossFireX, Quad GPU NVDIA SLI
• N BANCOS DE MEMORIA: 4
• N CONEXIONES SATA: 6
• N USB 2.0: 4 TRASEROS, 2 INTERNOS
• N USB 3.0: 3 TRASEROS, 2 INTERNO
• N USB 3.2 Gen1: 2 TRASEROS, 1 TRASERO TIPO C, 1 INTERNO TIPO C
• PCI: 3 PCIe x16, 2 PCIe x1
• RAID: SI
• SATA 6GB/s: 6
• SOCKET: AMD AM4
• TECNOLOGIA DE MEMORIA: DDR4
• TIPO DE RAID: 0,1,10
• TIPO MEMORIA: 4 x DDR4 4400(O.C.) / 4300(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200(O.C.) / 3000(O.C.) / 2800(O.C.) / 2666(O.C.) / 2400(O.C.)
• USB 3.0: SI
• USB3.0 INTERNO: SI
• USB3.1 INTERNO: SI

Volver a la página anterior